A novel methodology for studying the formation of surface deposited corrosion inhibitors on copper has been developed. The methodology has been reported previously, including a detailed study of the mechanism of film formation. This study continues the use of the test method; detailing kinetics of film formation for various surface deposited film inhibitors not previously reported, corrosion rates using various inhibitors and affects of halogenated compounds. Results of synergistic mixtures of film deposited inhibitors will also be presented.
13-18: Film Formation, Stability and Corrosion Inhibition of Surface Deposited
Jon J. Cohen and Sean Parmelee, H-O-H Water Technology